Launch of MediaTek Dimensity 7400 and Dimensity 7400x SoC Featuring Integrated NPU: Specifications Revealed

MediaTek recently introduced two new chipsets designed for mobile devices, named the Dimensity 7400 and Dimensity 7400X. These new processors focus on different types of smartphones, as the company aims to offer options for mainstream devices while also supporting more advanced models like the premium Dimensity 9400. The Dimensity 7400 is an upgrade from last year’s Dimensity 7300, while the Dimensity 7400X is tailored to enhance the experience of using foldable smartphones.

Both chipsets have an octa-core structure and include a built-in neural processing unit (NPU) that enhances the artificial intelligence (AI) features in mobile devices. This announcement follows the introduction of the Dimensity 6400 processor, which the company launched for mid-range devices just last week. MediaTek expects that smart devices featuring the Dimensity 7400 and 7400X will start appearing in stores by the first quarter of 2025.

The two new chipsets share many similar specifications—the main difference lies in their intended usage. While the Dimensity 7400 is designed for standard smartphones, the Dimensity 7400X is aimed at foldable devices. Both chipsets utilize TSMC’s advanced 4nm technology, featuring four Arm Cortex-A78 cores with speeds up to 2.6GHz and four Arm Cortex-A55 cores running at 2.0GHz. They also incorporate an Arm Mali-G615 MC2 graphics processing unit (GPU).

Because of their architecture, MediaTek claims that these new chipsets use 14 to 36 percent less power during gaming compared to other processors on the market. They also include the latest MediaTek Advanced Gaming Technology (MAGT) 3.0, which enhances graphics performance, optimizes AI features for gaming, reduces input lag, and enables better power efficiency. In addition to building on the AI features from earlier versions, the new chips have MediaTek’s NPU 6.0, which offers a 15 percent improvement in AI-related tasks.

The devices utilizing these chipsets will support high-speed performance with LPDDR5 RAM and UFS 3.1 storage. Smartphones featuring the Dimensity 7400 series will also be capable of handling impressive camera technology, supporting up to 200-megapixel sensors. This is made possible by the MediaTek Imagiq 950, which enhances image quality through techniques like motion-compensated noise reduction, hardware face detection, and video HDR. The chipset can also capture and play back video in 4K resolution at 30 frames per second.

The Dimensity 7400 series supports high-definition displays, capable of offering full HD+ resolution at a refresh rate of 144Hz, or a wider full HD+ resolution at 120Hz. Connectivity features include MediaTek’s 5G R16 modem that can achieve download speeds of up to 3.27Gbps, along with support for Wi-Fi 6E and Bluetooth 5.4. The modem also incorporates 3CC carrier aggregation technology, claiming to use 20 percent less power compared to competing chipsets.

Moreover, the MediaTek Dimensity 7400 series chipsets support multiple satellite systems, including QZSS, Galileo, Beidou, GLONASS, NavIC, and GPS, ensuring accurate location services for users. Overall, these advancements aim to enhance the performance and efficiency of future smartphones, particularly in gaming, photography, and connectivity.